Exposure Machine
Drilling Machine-Schmoll
PTH Line
Solderability Preservative
Automatic Lamination
Roll To Roll
Inner Brown Oxide Line
CNC Routing Machine
Laser Direct Imaging
Immersion Line
PCB Assembly
Automatic Loader
Screen Printer
High Speed Chips Mounter
Multifunction IC Mounter
Automatic Unloader
BGA Rework Machine
Electron Microscope
Bake Oven
Oven Temperature Tester
PCB Design
Parts Sourcing
CEC Port
RS Compenents
AOI Inspection
Wave Soldering
Wave Soldering
Anti-Corrosion Paint
Anti-Corrosion Paint
Fixture Custom
Fixture Custom
LCD Screen Custormization
LCD Screen Custormization
Stainless Steel Machining
Carbon Fibre

1) IPC610-D
2) ISO9001 /ISO14001
3) Over 99.5% Qualified Rate
4) Advanced quality testing equipment
5) The AOI optical machine detects the defects of any solder spot according to the IPC610D standard.
6) The sample is 100% X-RAY RAY detection to ensure the reliability of BGA per solder ball.
7) Temperature control in the plus or minus 0.1 ℃ to ensure every piece of plate welding quality
8) The SMT automatic first tester ensures that the parameters of each component(Resistance,Capacitance,Inductance) are within the standard range.
9) High - resolution CCD microscope can check the hidden danger of fine quality.
10) Product function analysis equipment to ensure timely detection of poor test function of the product, the function of rapid maintenance.

11) The whole process of anti-static production and manufacturing environment.


Our process of visual inspection begins with product handling.  All inspectors must take and pass the Electrostatic Discharge Sensitive Safety Standard (ESDS) on their first day of employment and continuously be retrained.  This knowledge is critical for receiving inspections and shipping preparation.  Our inspection work stations are state of the art, equipped with dinocam microscopes, digital cameras with macro capability, scales, handling tools, bar code scanners, multiple magnifiers, reel to reel counters, measurement tools and humidity control supplies such as vacuum sealers, desiccants, humidity indicator cards and room humidity monitors.  Package inspections includes photos of outside labels, photos to assure no damage to outer package, properly sealed, correct date codes, correct manufacturer logos, bar codes scanned and photos are uploaded to database for each order.  Interior contents are inspected for proper quantities, date code/lot codes, manufacturer, part number, and condition of all surfaces.  All parts will be subjected to datasheet references for package and configuration dimensions, resistant to solvents using 3:1 mineral spirits/alcohol solution, acetone and scrape test. 


After completion of visual inspection all parts supplied toindustries will receive full component authentication via our in-house, certified test labs.  These tests will include Real-Time X-Ray Analysis, XRF Elemental Analysis, Scanning Electron Microscopy (SEM), Heated Solvent Testing, Decapsulation and Die Microscopy and Solderability Testing, all documented on an extensively detailed report.  In-house value added services can include tape in reel, dry baking, DNA Marking and Electrical Functionality Testing.


Before any employee is allowed to enter the component inspection, testing, packaging or warehousing areas, they must first pass through a custom designed “ESD Airlock System” and pass the ESD training guide exam.

This mandatory electronic test point (ESD Airlock System) monitors both footwear and wrist straps testing proper position and grounding before the ESD test system will release the electric door strike. This acquired authorization grants access to critical component handling areas.


Our Quality Technicians rigorously inspect and document all incoming and outgoing components for proper packaging, condition, count, authenticity and overall quality.

To track inventory movement throughout the warehouse, We uses the latest warehouse barcode scan system from Symbol Technologies. This software tracks every piece of crucial information: bin locations, manufacturer information, part numbers, FIFO layers, quantities, date codes, order numbers and customer internal part numbers.



PCB Fab:
*Fabricator shall adjust solder mask clearance per their process to meet the requirements of IPC-6012.
* Test and mount points shall be free of plug and solder mask materials.
* LPI (Liquid Photo Imageable) solder mask shall be applied over bare copper, on both sides, per IPC-SM-840 CLASS H.
* SMD pad plating shall be flat to a maximum of 0.08 mm (3 mils) above board surface.
* Exposed copper minimum 100 micro inches of nickel and minimum 51 micro inches of hard gold. All other exposed conductive surfaces shall be plated with ENIG plating with minimum 51 micro inches of nickel and maximum 31 micro inches of gold.
* All vias shall be plugged with epoxy fill and then plated over.Copper wrap over vias is allowed to be per IPC-6012 CLASS 2 requirements.
* Impedance controlled manufacturing.
* Material shall be copper clad laminates ISOLA 370HR or equivalent, RoHS compliant UL designation: ANSI grade FR-4, as per IPC 4101.
* Fabrication shall be in accordance with IPC-6012 TYPE 3 per IPC-6011 CLASS 3.
*No conformal coating shall be applied to the PCB.
* Warp or twist of PCB shall not exceed 0.75%.
* All burrs shall be removed and all sharp edges shall be broken to a maximum of 0.4 mm (15mils)
* PCBs shall be 100% electrically tested using a supplied IPC-356A netlist.All nets shall be checked for continuity and shorts.
* Test data and certificate of compliance shall be supplied with each batch of PCBs.
* No ink marking shall be on bare metal areas.
* The finished PCB shall meet the requirements of UL796 with flammability rating of 94V-0.
* Solderability – Adhesion report.
* Plating adhesion report.
* Artworks files are provided in Gerber, ODB++, and IPC-2581 formats.Drill files are provided in ASCII Excellon format.



PCB Assembly:
* Assembly and solder inspection criteria shall be as per IPC-A-610 CLASS 3.Assembly shall be cleaned post soldering as per IPC-CH-65A and IPC-AC-62A.
* The minimum size of SMD components used is 0201 (imperial).
* Critical mounting and inspection shall be within 0.013 mm (5 mils) where indicated.
*Material(Solder paste)certification and traceability documents shall be included in the shipment.
* Convection reflow or equivalent techniques shall be used for soldering.No vapor-phase or IR reflow soldering shall be used.
* The assembler shall optimize paste mask to their processes.SMT paste mask optimizations should only be performed on apertures present on the paste mask layers.
* No pads that are not present on the paste layers shall be opened.
* A complete X-ray inspection shall be performed on all BGA components.
* PCBA edges shall be smoothed/deburred of any break points (mouse-bites) or sharp edges after depanelization.
* Parts and assemblies shall be handled in a static safe work area and transported in a nonconductive and shielded container.The shipping container shall be clearly marked with the applicable BOM number and quantity of PCBAs enclosed.
* X-Ray report for solder junctions.


PCB and Stencil Cleaning Equipment:
For board washing, The Equipment carries the full range of Trident PCB cleaning machines. Get fully cleaned boards no matter what your installation requirements with full drain, rinse water cycling, or zero discharge PCB cleaner. For stencils and PCB misprints, our ultrasonic stencil cleaners quickly and completely remove solder pastes and uncured adhesives.