PCB Fab
Etching
Exposure Machine
Drilling Machine-Schmoll
PTH Line
Solderability Preservative
Automatic Lamination
Roll To Roll
Inner Brown Oxide Line
CNC Routing Machine
Laser Direct Imaging
Immersion Line
Pre-Treatment
PCB Assembly
Automatic Loader
Screen Printer
High Speed Chips Mounter
Multifunction IC Mounter
Reflow
Automatic Unloader
BGA Rework Machine
Electron Microscope
Bake Oven
Oven Temperature Tester
Components
Resistance
Capacitance
Inductance
MOS
MCU/ICS
DC/DC
Relays
Module
Others
PCB Design
Parts Sourcing
Mouser
PWG
CEC Port
Digi-Key
Avnet
RS Compenents
Arrow
Element14
AOI
AOI Inspection
X-Ray
X-Ray
Wave Soldering
Wave Soldering
ICT
ICT
Anti-Corrosion Paint
Anti-Corrosion Paint
Fixture Custom
Fixture Custom
LCD Screen Custormization
LCD Screen Custormization
Others
Stainless Steel Machining
Carbon Fibre
Immersion Line

HORIZONTAL IMMERSION
SILVER PROCESS

Silver thickness reaches 0.1 μm ~ 0.5 μm, no oxidation

WORKING PRINCIPLE
Deposit a silver layer on areas where part soldering or assembly to enhance the solderability. PROCESS Inlet → Cleaning → Rinsing → Micro-Etching → Rinsing → Pre-Immersion → Electroless Silver → Hot Water Rinsing → Rinsing → Post Cleaning → Rinsing → Hot Water Rinsing → Drying → Output

 


Immersion Silver Drilled Flood Bar


TECHNICAL SPECIFICATION
• Panel size: max. 610 × 610 mm / min. 250 × 250 mm
• Panel thickness: 0.1 mm ~ 3.2 mm
• Hole diameter: PTH Hole diameter: min 0.1 mm A/r 10:1 BVH Hole diameter: min 0.075 mm A /r 1:1

FEATURES
Efficient cleaning ability, to prevent ion contamination
• No roller mark, water mark and scratch
• No dirt or residual chemicals after wet cleaning
• High conveying stability with deviation at ±10 mm
• Process procedures matching to the solutions and demands of customers
• Equipped with automatic control systems to ensure process parameter stability
• Over 95 % modularized products to maximize part sharing
• Excellent squeeze roller design with drag out ≤10 cc/m2 to prevent chemistry drag out and contamination
• Slope bottom tank design for the chemical process to minimize solution leftover and wastewater treatment load after rinsing
• Condenser to reduce solution loss by 50 % and exhaust loading
• Slope-bottom and small-volume tank design for the rinsing to increase the refresh rate
• Maximum uptime ≥ 95 %
• Easy to operate and maintain with visualized management PLC + HMI
• Comply with environment-friendly policy

HORIZONTAL IMMERSION
TIN PROCESS

Enhance cleaning ability to prevent ion contamination

WORKING PRINCIPLE
Deposit a tin layer on areas where part soldering or assembly to enhance the solderability.

PROCESS
Inlet → Acid Rinsing → Rinsing → Micro-Etching → Rinsing → Pre-Immersion → Immersion → Post-Immersion → Effluent Rinsing → Rinsing → RAD / NPT Tanks → Rinsing → Hot Ultrasonic Rinsing → Rinsing → RPT/NPT Tanks → Rinsing → Drying → Output

 

 


Preassemble Piping Indirect Heating


TECHNICAL SPECIFICATION
• Panel size: max. 610 × 610 mm / min. 250 × 250 mm
• Panel thickness: 0.1 mm ~ 3.2 mm
• Hole diameter: PTH Hole diameter: min 0.1 mm A/r 10:1 BVH Hole diameter: min 0.075 mm A /r 1:1

PRODUCT FEATURES
No whisker process from our chemical coordinator, completely eliminate the whisker risk
• No roller mark, water mark and scratch
• No dirt or residual chemicals after wet cleaning
• No whisker process from our chemical coordinator, completely eliminate the whisker risk
• High conveying stability with deviation at ± 10 mm
• Process procedures matching to the solutions and demands of customers
• Equipped with automatic control systems to ensure the longest uptime
• Over 95 % modularized products to maximize parts sharing
• Excellent squeeze roller design with drag out ≤10 cc/m2 to prevent chemistry drag out and contamination
• Slope bottom tank design for the chemical process to minimize solution leftover and wastewater treatment load after rinsing
• Condenser to reduce solution loss by 50 % and exhaust loading
• Slope-bottom and small-volume tank design for the rinsing process to increase the tank replacement rate by 50 %
• Maximum uptime ≥ 95 %
• Easy to operate and maintain with visualized management PLC + HMI
• Comply with environment-friendly policy