HORIZONTAL OXIDE REPLACEMENT
PROCESS
Solder float test more than five times, higher adhesive strength for Oxide film key

WORKING PRINCIPLE
Form high anti-tear strength oxidization layer on the inner layer to enhance the bonding of the inner layer and prepreg during lamination.

PROCESS
Inlet → Acid Rinsing → Rinsing → Alkaline Rinsing → Rinsing → Pre-Dip → Oxide Replacing → Rinsing → Drying → Output

Oxide Replacement	Drying	Cool Air-Knife

TECHNICAL SPECIFICATION
• Panel size: max. 610 × 610 mm / min. 250 × 250 mm
• Panel thickness: 0.05 mm (core) + Cu ~ 3.2 mm of traditional PCB 0.8 mm ~ 12 mm of back panel

FEATURES
Uniformed color and oxidization layer. Bonding ability ≥ 3.0 lb / in2
• No roller mark, water mark and scratch
• Minimum 5 times of thermal shock test
• Uniformed color and oxidization layer Bonding ability ≥ 3.0 lb / in2
• No dirt or residual chemicals after wet cleaning
• High conveying stability with deviation at ± 10 mm
• Process procedures matching to the solutions and demands of customers
• Equip automatic control systems to ensure process parameter stability
• Over 95 % modularized products to maximize parts sharing and prevent scratchesof cooper oxide velvet crystals after replacement
• Excellent squeeze roller design with drag out ≤ 10 cc / m2 to prevent chemistry drag out and contamination
• Slope bottom tank design for the chemical process to minimize solution leftover and wastewater treatment load after rinsing
• Condenser to reduce solution loss by 50 % and exhaust loading
• Slope-bottom and small-volume tank design for the rinsing process to increase the tank replacement rate by 50 %
• Maximum uptime ≥ 95 %
• Easy to operate and maintain with visualized management PLC + HMI
• Comply with environment-friendly policy