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Etching

DEVELOPING ETCHING
STRIPPING PROCESS


Uniform etching ability, Etching Uniformity > 90%
WORKING PRINCIPLE
Form the circuit pattern by photo-resist developing, etching and photo-resist stripping (acid etching).

PROCESS
Inlet → Developing → Post Developing → Rinsing → Pre-Etching → Etching → Rinsing → Stripping → Post-Stripping → Antitarnish → Rinsing → Drying → Output * All processes can fully integrated with fast vertical etcher.

 

Pneumatic Spray Etching Dry Film Sludge Separation System


TECHNICAL SPECIFICATION
• Panel size: max. 610 × 610 mm / min. 250 × 250 mm
• Panel thickness: 0.05 mm (core) + Cu ~ 3.2 mm of traditional PCB 0.8 mm ~ 12 mm of back panel
• Hole size: PTH Hole: min 0.1 mm A /r 10:1 BVH Hole: min 0.075 mm A /r 1:1
• Development capability: Line width / Line distance 25 μm / 25 μm
• Etching capability: Copper thickness 18 μm: Line width / Line Distance 50 μm / 50 μm Copper thickness 36 μm: Line width / Line distance 75 μm / 75 μm.

FEATURES
Etching factor ≥ 4.0 to prevent resin smear
• No roller mark, water mark and scratch
• No dirt or residual chemicals after wet cleaning
• Etching factor ≥ 4.0, no resist scum
• Excellent etching uniformity
• High conveying stability with deviation at ± 10 mm ( with width control device )
• Process procedures matching the solutions and dry films used by customers
• Equipped with automatic control systems to ensure the longest uptime
• Compatible with the etching solution automatic control system to ensure excellent etching parameter control
• Over 95 % modularized products to maximize parts sharing and prevent scratches of dry film and circuit
• Excellent squeeze roller design with drag out ≤ 10 cc/m2 to prevent chemistry drag out and contamination
• Slope bottom tank design for the chemical process to minimize solution leftover and wastewater treatment load after rinsing
• Slope-bottom and small-volume tank design for the rinsing process to increase the tank replacement rate by 50 %
• Condenser to reduce solution loss by 50 % and exhaust loading
• Maximum uptime ≥ 95 %
• Comply with environment-friendly policy