
- PCB Fab
- Etching
- Exposure Machine
- Drilling Machine-Schmoll
- PTH Line
- Solderability Preservative
- Automatic Lamination
- Roll To Roll
- Inner Brown Oxide Line
- CNC Routing Machine
- Laser Direct Imaging
- Immersion Line
- Pre-Treatment
- PCB Assembly
- Automatic Loader
- Screen Printer
- High Speed Chips Mounter
- Multifunction IC Mounter
- Reflow
- Automatic Unloader
- BGA Rework Machine
- Electron Microscope
- Bake Oven
- Oven Temperature Tester
- Components
- Resistance
- Capacitance
- Inductance
- MOS
- MCU/ICS
- DC/DC
- Relays
- Module
- Others
- PCB Design
- AOI
- AOI Inspection
- X-Ray
- X-Ray
- Wave Soldering
- Wave Soldering
- ICT
- ICT
- Anti-Corrosion Paint
- Anti-Corrosion Paint
- Fixture Custom
- Fixture Custom
- LCD Screen Custormization
- LCD Screen Custormization
Our PCB production solutions apply for PCB wet production process, the product portfolio including the process tools of pre-treatment, development-etching-stripping, oxide replacement, DSM & PTH, development, immersion silver, immersion tin, OSP and automation systems.
They are characterized by
• Low water and chemical consumption reduce running cost and minimize impact on the environment.
• Customized design to meet process demands.
The aim is to achieve highly reliable production processes on the customer side while steadily improving performance parameters for products manufactured.
• Fine line has integrated with direct image systems and high resolution DES sys- tems. The new solution helps to create the fine line pattern to maximum a utility of PCB layout within a limited space.
PRE-TREATMENT
PROCESS
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Solder Mask Pre-Clean(Ultra-Roughness) | Direct Spray. No Shadow |
TECHNICAL SPECIFICATION
• Panel size: max. 610 × 610mm / min. 250 × 250mm
• Panel thickness: 0.05 mm (core) +Cu ~3.2 mm of Traditional PCB 0.8 mm ~ 12 mm of back panel
• Hole diameter: PTH min 0.1 mm A /r 10:1 BVH min 0.075 mm A /r 1:1
FEATURES
Excellent cleaning ability without chemical residuals to prevent oxidation
• No roller mark, water mark and scratch
• Micro-etching depth 1.0 μm~ 1.5 μm
• Water break test for at least 30 seconds ( with pure water cleaning )
• No oxidization after standing in the clean room for 4 hours
• No dirt or residual chemicals after wet cleaning
• Accurate transporting systems with deviation at ±10mm
• Compatible with the chemical requirement and needs of customers
• Equipped with automatic control systems to ensure longest uptime
• Over 95 % modularized products to maximize parts sharing
• Excellent squeeze roller design with drag out ≤10cc/m2 to prevent chemistr drag out and contamination
• Slope bottom tank design for the chemical process to minimize solution leftover and wastewater treatment load after rinsing
• Slope-bottom and small-volume tank design for the rinsing process to increase the tank replacement rate by 50%
• Condenser to reduce solution loss by 50% and exhaust loading
• Maximum uptime ≥ 95%
• Easy to operate and maintain with visualized management PLC + HMI (optional with CIM)