Our PCB production solutions apply for PCB wet production process, the product portfolio including the process tools of pre-treatment, development-etching-stripping, oxide replacement, DSM & PTH, development, immersion silver, immersion tin, OSP and automation systems.
They are characterized by
• Low water and chemical consumption reduce running cost and minimize impact on the environment.
• Customized design to meet process demands.
The aim is to achieve highly reliable production processes on the customer side while steadily improving performance parameters for products manufactured.
• Fine line has integrated with direct image systems and high resolution DES sys- tems. The new solution helps to create the fine line pattern to maximum a utility of PCB layout within a limited space.

PRE-TREATMENT
PROCESS
 

Solder Mask Pre-Clean(Ultra-Roughness)	Direct Spray. No Shadow

                                  
TECHNICAL SPECIFICATION
• Panel size: max. 610 × 610mm / min. 250 × 250mm
• Panel thickness: 0.05 mm (core) +Cu ~3.2 mm of Traditional PCB 0.8 mm ~ 12 mm of back panel
• Hole diameter: PTH min 0.1 mm A /r 10:1 BVH min 0.075 mm A /r 1:1

FEATURES
Excellent cleaning ability without chemical residuals to prevent oxidation
• No roller mark, water mark and scratch
• Micro-etching depth 1.0 μm~ 1.5 μm
• Water break test for at least 30 seconds ( with pure water cleaning )
• No oxidization after standing in the clean room for 4 hours
• No dirt or residual chemicals after wet cleaning
• Accurate transporting systems with deviation at ±10mm
• Compatible with the chemical requirement and needs of customers
• Equipped with automatic control systems to ensure longest uptime
• Over 95 % modularized products to maximize parts sharing
• Excellent squeeze roller design with drag out ≤10cc/m2 to prevent chemistr drag out and contamination
• Slope bottom tank design for the chemical process to minimize solution leftover and wastewater treatment load after rinsing
• Slope-bottom and small-volume tank design for the rinsing process to increase the tank replacement rate by 50%
• Condenser to reduce solution loss by 50% and exhaust loading
• Maximum uptime ≥ 95%
• Easy to operate and maintain with visualized management PLC + HMI (optional with CIM)